EMI Tin-Plated Copper Foil Tape with Conductive Adhesive Tape for resists oxidation and corrosion 3M 1183 Alternatives

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Product Description 3M 1183 EMI Tin-Plated Copper Foil Tape is made from a 1-ounce dead soft tin-plated copper foil backing and an electrically conductive, pressure-sensitive acrylic adhesive.This tape is supplied on a removable liner for easy handling and die-cutting. It has excellent solderability.The tin plating facilitates soldering to the backing and resists oxidation and corrosion. Features The tin plating facilitates soldering to the backing and resists oxidation and corrosion. Tin-Pl...


  • Die Cutting: Available
  • Customized Solution: Available
  • Factory Inspection: Available
  • Samples Delivery day: 3 days by air express
  • Certification: SGS, ROSH, ISO
  • Product Detail

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    Product Description

    3M 1183 EMI Tin-Plated Copper Foil Tape is made from a 1-ounce dead soft tin-plated copper foil backing and an electrically conductive, pressure-sensitive acrylic adhesive.This tape is supplied on a removable liner for easy handling and die-cutting. It has excellent solderability.The tin plating facilitates soldering to the backing and resists oxidation and corrosion.

    Features

    • The tin plating facilitates soldering to the backing and resists oxidation and corrosion.
    • Tin-Plated Copper Foil Tape 1183 is a tin-plated copper foil tape with acrylicconductive pressure-sensitive adhesive.
    • The tape shall be coated on one side with pressure-sensitive adhesive, which shall not require heat, moisture or other preparation prior to or subsequent to application.
    • The adhesive coating shall be smooth and uniform and be free of lumps and bare spots.
    • There shall be no separator between adjacent layers of the roll.
    • The tape shall perform at a temperature of -40F° (-40°C) to 266°F (130°C) without substantial loss of tensile or electrical properties.

    Datasheet

    3m 1183 conductive tape datasheet

    Application

    • Tin-Plated Copper Foil Tape 1183 is typically used for applications requiring excellent electrical conductivity from the application substrate through the adhesive to the foil backing.
    • Common uses include grounding and EMI shielding in equipment,components, shielded rooms, etc.
    • The tin plating facilitates soldering to the backing and resists oxidation and corrosion.
    • Applied in the car controller, anti-electromagnetic wave.

     

     


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