Copper-clad Polyimide Film Used for Flexible Printed Circuits and Cable Assemblies(FPCs)
Product Description
Copper-clad polyimide film is polyimide film laminated with copper foil which widely used as flexible printed circuits (FPCs). It has excellent physical, chemical, and electrical properties, atomic radiation resistant, solvent resistant, low & high temperature resistant, and performs successfully in the wide range of temperature as low as -452F(-269c) and as high as +752F(+400c). Because of its unique excellent properties, it is the most ideal choice in many insulation applications.
Structures
| Cu foil |
| PI Film |
Features
- Easy coating property.
- Flame, Radiation, retardant property.
- High temperature electrical insulation.
- High bond and dielectric strength.
- Excellent voltage-resistance and tensile strength.
- Excellent balance of electrical, chemical and physical property.
Datasheet
|
Properties |
Unit |
Values |
|
|
KZCCPF019 |
|||
|
Thickness |
mm |
0.038 |
|
|
Thickness Tolerance |
% |
≤±10 |
|
|
Tensile Strength |
MD |
M Pa |
≥110 |
|
TD |
≥80 |
||
|
Elongation |
MD/TD |
% |
≥40 |
|
Breakdown Strength |
KV/mm |
≥ 120 |
|
|
Peel Strength |
N/25mm |
≥ 3 |
|
|
*Corona resistance, frequency 20KHz temperature 155℃±2℃, pulse rise time 50ns |
2KV |
Min |
100 |
|
3KV |
25 |
||
|
*Volume resistivity 200+/-5c(392F) |
Ω · m |
≥1×1013 |
|
|
*Surface resistance 200+/-5c(392F) |
Ω |
≥1×1010 |
|
Applications
- For Automotive Flex Circuit Cable Assemblies.
- For Disk Drive Flex Circuit Designs.
- For Minimizing Signal Loss at High Speeds.
- For Satellite, Radar & Communications Systems.
- For Space & Avionics Instrumentation.
- Cover or Stiffener in F-PCB.
- Polyimide Label and tubing.
- Transformer and Motor Insulation.
- Polyimide Adhesive tape or polyimide laminate.
- Bar code label, machine part , electronic component , electrical insulation, COF substrates.Wire & cable Insulation, slot liner insulation, interlayer insulation in Motor, transformer etc.
