High Temperature Polyimide Thermal Transfer Labels PCB Tracking Label stock Die Cutting
Products Description
Thermal Transfer Polyimide Label Material is a polyimide film product that offers ultra-high temperature performance. which can withstand up to 320°C short-term,280°C long-term heat resistance. It has excellent heat resistance and low outgassing characteristics. Matte white thermal transfer topcoat for easy readability of barcodes and variable information.
Features
- Matte white thermal transfer topcoat for easy readability of barcodes and variable information.
- High temperature label stock: Acrylic and polyimide materials
- Durable and UV resistant
- Limited tamper evident properties on certain label stock
- Thermal transfer and dot matrix printable
- Compatible with lead-free solder reflow process
- UL and CSA approved
- RoHs and WEEE Compliant*
- 50# densified kraft liner assures consistent die cutting.
Application Ideas
Printed circuit board tracking labels that see the following conditions:
Solder wave reflow
- IR reflow
- Top and/ or bottom side wave solder
- Most cleaning processes and chemicals
Datasheet
|
Physical Characteristics |
Standard Values |
|
Backing |
Polyimide Film |
|
Release Paper |
Glassine |
|
Adhesive Type |
Acrylic |
|
Adhesive Thickness |
0.03±0.002mm |
|
Backing Thickness |
0.05±0.004 mm |
|
Coating Thickness |
0.018+0.003mm |
|
Release Paper Thickness |
0.078±0.006 mm |
|
Color |
White |
|
Peel Strength |
18±5 gm/25mm |
|
Short Term Temperature |
320℃*10s |
|
Long Term Temperature |
280℃ *10min |
|
Adhesion |
0.6↑ kg /25mm |
Note:
Values should be used for specification purposes and are averages taken from PSTC and ASTM test methods. The company does not warranty performance in specific applications. Since product performance may vary, each user should conduct their own test to determine the products fit for use in specific applications. The purchaser shall assume all risks and liabilities in connection therewith.
